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Detection of Thin Wafer Slices Laser Distance Sensors Triangulation in Production Systems 1

Detection of Thin Wafer Slices Laser Distance Sensors Triangulation in Production Systems 2

Detection of Thin Wafer Slices Laser Distance Sensors Triangulation in Production Systems 3

Detection of Thin Wafer Slices Laser Distance Sensors Triangulation in Production Systems

During the production of multi-layer cookies, individual wafer slices are transported on conveyor belts before they are coated with cream and processed into a stacked cookie. Laser distance sensor triangulation precisely detects the position of the wafer slices and thus controls the material flow of the system. Thanks to the integrated jump detection, the wafer-thin slices, just one millimeter high, can also be reliably detected on the slightly fluctuating conveyor belt. Even if the sensor is misaligned, it does not need to be re-taught in, as it reacts to the jump.

Laser Distance Sensors Triangulation

The contactless laser triangulation sensors work according to the angle measurement principle, which enables reliable and highly precise measurement in the close range up to 1,000 mm. The triangulation sensors deliver stable measured values regardless of colors, shapes, rough and textured surfaces.

Matching Products

The products listed here are ideal for use in this application.

P3PC301 Laser Distance Sensor Triangulation

Range 60...660 mm Speed 650 Hz Output PNP Linearity Deviation 900 µm Reproducibility maximum 550 µm Circuit NO

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P3PC302 Laser Distance Sensor Triangulation

Range 60...660 mm Speed 650 Hz Output NPN Linearity Deviation 900 µm Reproducibility maximum 550 µm Circuit NO

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P3PC202 Laser Distance Sensor Triangulation

Range 50...350 mm Speed 650 Hz Output NPN Linearity Deviation 300 µm Reproducibility maximum 100 µm Circuit NO

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P3PC201 Laser Distance Sensor Triangulation

Range 50...350 mm Speed 650 Hz Output PNP Linearity Deviation 300 µm Reproducibility maximum 100 µm Circuit NO

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