ShapeDrive G4 3D Sensors. Excellence in Shape.
The measuring principle of the 3D machine vision sensor ShapeDrive G4 is based on triangulation and structured light. Several patterns are projected onto the object via the illumination, while it is captured synchronously by a camera. Sophisticated algorithms are used to calculate a 3D point cloud from the various images. The internal calculation is carried out using the fastest electronics. The 3D sensors of the ShapeDrive G4 series, also known as snapshot sensors, are available with different measuring ranges or measuring volumes, so that a sensor can always be selected to suit the application. See the high quality of the 3D point cloud for yourself.
ShapeDrive G4: Quadruple Ingenious Performance on One Chip

1. Processing Unit
Central processor unit for liquid command processing, control and communication.
2. Field Programmable Gate Array (FPGA)
Real-time processing unit for fast calculation of 3D point clouds in less than 250 milliseconds.
3. Memory
Large (4 GB) and fast (19.2 Gbit/s) memories enable reliable processing of huge amounts of data.
4. Connectivity
Fast transmission speeds thanks to the integrated 1/10 Gigabit Ethernet interface.
The Benefits of ShapeDrive G4
ShapeDrive G4 sensors are designed to the highest quality in all respects. All components of the ShapeDrive G4 series such as optics, mechanics, electronics, firmware and software must fulfill the highest quality requirements. This ensures a long service life with stable and reproducible results, as expected in industrial applications. Many different factors influence quality. The most important of these are explained below.

Excellence Through 3D Point Cloud

Stability Through Temperature Management

Reliability Through Calibration

Uniformity Through Interface Concept

Up-to-Date at All Times Through Updates

Flexibility Thanks to a Wide Range of Models
ShapeDrive G4 MLAS 3D Sensors – Precision for Small Measuring Volumes

The 3D Point Cloud of the MLAS 3D Sensors
The Advantages of the MLAS Series at a Glance
The Measuring Volume of the MLAS 3D Sensors

In addition to the 1/10 Gigabit Ethernet interface for the fastest data transmission, the sensor also offers digital I/Os for integration, so that the sensor can communicate directly with the environment.
The sensor has standard M12 connections and can therefore be used with standard industrial connection technology. The IP67 housing offers reliable operation in a harsh or often dusty manufacturing environment.
The MLAS 3D Sensor Models
MLAS112 | MLAS113 | MLAS114 | |
---|---|---|---|
Working range Z | 300…340 mm | 220…320 mm | 400…600 mm |
Measuring range Z | 40 mm | 100 mm | 200 mm |
Measuring range X | 60 mm | 120 mm | 240 mm |
Measuring range Y | 48 mm | 90 mm | 200 mm |
Resolution Z | 3…4 µm | 4…8 µm | 13…30 µm |
Resolution X/Y | 30…34 µm | 47…69 µm | 115…172 µm |
Housing dimensions | 60 × 250.8 × 160 mm | 60 × 250.8 × 160 mm | 60 × 250.8 × 160 mm |
MLAS212 | MLAS213 | MLAS214 | |
---|---|---|---|
Working range Z | 255…295 mm | 220…320 mm | 270…470 mm |
Measuring range Z | 40 mm | 100 mm | 200 mm |
Measuring range X | 60 mm | 120 mm | 240 mm |
Measuring range Y | 40 mm | 80 mm | 160 mm |
Resolution Z | 1…2 µm | 2…5 µm | 3…9 µm |
Resolution X/Y | 18…20 µm | 30…44 µm | 37…65 µm |
Housing dimensions | 60 × 250.8 × 160 mm | 60 × 250.8 × 160 mm | 60 × 250.8 × 160 mm |
3D Sensors ShapeDrive G4 MLBS – Large Measuring Volumes

The MLBS series sensors have a symmetrical design, meaning that the measuring volume is not located directly under the sensor’s camera, but in the middle of the sensor. This can be recognized by the symmetrical tilting of the illumination and the camera. The symmetry reduces shadowing effects, such as with crates, enabling the entire crate to be recorded.
The 3D Point Cloud of the MLBS 3D Sensors
The Advantages of the MLBS Series at a Glance
El volumen de medida de los sensores 3D MLBS

La carcasa de aluminio proporciona una protección fiable en un entorno de fabricación. Gracias a su clase de protección IP67, los sensores son aptos para su uso en entornos industriales adversos. El sensor dispone de conexiones estándar M12, por lo que se puede utilizar con la tecnología de conexión estándar más habitual en la industria.
MLBS111 | MLBS112 | MLBS115 | |
---|---|---|---|
Rango de trabajo Z | 1.050…1.450 mm | 1.550…2.050 mm | 1.750…2.750 mm |
Rango de medición Z | 400 mm | 500 mm | 1.000 mm |
Rango de medición X | 500 mm | 750 mm | 1.300 mm |
Rango de medición Y | 380 mm | 560 mm | 1.000 mm |
Resolución Z | 40 µm | 50 µm | 80 µm |
Resolución X/Y | 281 µm | 406 µm | 660 µm |
Dimensiones de la carcasa | 60 × 214 × 375 mm | 60 × 214 × 554 mm | 60 × 214 × 611 mm |