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In the electronics industry, PCBs are fixed and conveyed laterally in transport modules, which can lead to bending. In order for the solder robot to compensate for this bend and create the ideal distance between the plate and the solder head, the bending of the PCBs must be measured. A laser distance sensor triangulation is installed for this purpose, which measures several points on the board from below. The control system uses the measured values to create a profile. The sensor measures precisely despite different colors and shiny solder pads and thus enables a reliable soldering process.