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Sha­pe­Dri­ve G4 3D Sen­sors. Ex­ce­llen­ce in Shape.

The Sha­pe­Dri­ve G4 3D sen­sors are high-​performance sen­sors in the field of re­so­lu­tion and mea­su­ring speed and are the pio­neers among 3D ma­chi­ne vi­sion sen­sors. Thanks to the in­te­gra­ted pro­ces­sing of the data into a 3D point cloud and a fast Ether­net in­ter­fa­ce with up to 10 Gbit/s, users can re­cei­ve and pro­cess 3D point clouds in the shor­test pos­si­ble time.

The mea­su­ring prin­ci­ple of the 3D ma­chi­ne vi­sion sen­sor Sha­pe­Dri­ve G4 is based on trian­gu­la­tion and struc­tu­red light. Se­ve­ral pat­terns are pro­jec­ted onto the ob­ject via the illu­mi­na­tion, while it is cap­tu­red syn­chro­nously by a ca­me­ra. Sophis­ti­ca­ted al­go­rithms are used to cal­cu­la­te a 3D point cloud from the va­rious ima­ges. The in­ter­nal cal­cu­la­tion is ca­rried out using the fas­test elec­tro­nics. The 3D sen­sors of the Sha­pe­Dri­ve G4 se­ries, also known as snapshot sen­sors, are avai­la­ble with dif­fe­rent mea­su­ring ran­ges or mea­su­ring vo­lu­mes, so that a sen­sor can al­ways be se­lec­ted to suit the ap­pli­ca­tion. See the high qua­lity of the 3D point cloud for your­self.
ShapeDrive G4
Benefits of ShapeDrive G4
MLAS Product Series
MLAS Models
MLBS 产品系列

Sha­pe­Dri­ve G4: Qua­dru­ple In­ge­nious Per­for­man­ce on One Chip

Thanks to the in­ge­nious Multiprocessor-​System-on-a-Chip tech­no­logy (MPSoC), the 3D sen­sors of the Sha­pe­Dri­ve G4 se­ries have a wide range of high-​performance fea­tu­res – all in the sma­llest of spa­ces.

1. Pro­ces­sing Unit
Cen­tral pro­ces­sor unit for li­quid com­mand pro­ces­sing, con­trol and com­mu­ni­ca­tion.

2. Field Pro­gram­ma­ble Gate Array (FPGA)
Real-​time pro­ces­sing unit for fast cal­cu­la­tion of 3D point clouds in less than 250 mi­lli­se­conds.

3. Me­mory
Large (4 GB) and fast (19.2 Gbit/s) me­mo­ries enable re­lia­ble pro­ces­sing of huge amounts of data.

4. Con­nec­ti­vity
Fast trans­mis­sion speeds thanks to the in­te­gra­ted 1/10 Gi­ga­bit Ether­net in­ter­fa­ce. 

The Be­ne­fits of Sha­pe­Dri­ve G4

Sha­pe­Dri­ve G4 sen­sors are de­sig­ned to the highest qua­lity in all res­pects. All com­po­nents of the Sha­pe­Dri­ve G4 se­ries such as op­tics, me­cha­nics, elec­tro­nics, firm­wa­re and soft­wa­re must ful­fill the highest qua­lity re­qui­re­ments. This en­su­res a long ser­vi­ce life with sta­ble and re­pro­du­ci­ble re­sults, as ex­pec­ted in in­dus­trial ap­pli­ca­tions. Many dif­fe­rent fac­tors in­fluen­ce qua­lity. The most im­por­tant of these are ex­plai­ned below.

Ex­ce­llen­ce Th­rough 3D Point Cloud

The 3D point cloud meets the highest de­mands thanks to the sophis­ti­ca­ted al­go­rithm com­bi­ned with the qua­lity of the hard­wa­re. This mi­ni­mi­zes or eli­mi­na­tes noise and other ar­ti­facts.

Sta­bi­lity Th­rough Tem­pe­ra­tu­re Ma­na­ge­ment

In ad­di­tion to high-​quality com­po­nents, all Sha­pe­Dri­ve G4 sen­sors have ac­ti­ve tem­pe­ra­tu­re ma­na­ge­ment. This tem­pe­ra­tu­re ma­na­ge­ment en­su­res that the sen­sor de­li­vers sta­ble and re­pro­du­ci­ble re­sults, even under fluc­tua­ting ex­ter­nal con­di­tions.

Re­lia­bi­lity Th­rough Ca­li­bra­tion

All Sha­pe­Dri­ve G4 sen­sors are ca­li­bra­ted and tes­ted prior to de­li­very. This en­su­res that the sen­sor re­mains sta­ble for years, with no re­ca­li­bra­tion re­qui­red. The sen­sor can the­re­fo­re be used per­ma­nently and without in­te­rrup­tion.

Uni­for­mity Th­rough In­ter­fa­ce Con­cept

The Sha­pe­Dri­ve G4 sen­sors can be in­te­gra­ted via an SDK or a GigE Vi­sion in­ter­fa­ce. The sen­sor is con­nec­ted to the ap­pli­ca­tion and ready for im­me­dia­te use in just a few steps. The in­te­gra­ted web ser­ver sim­pli­fies hand­ling and con­fi­gu­ra­tion.

Up-​to-Date at All Times Th­rough Up­da­tes

wen­glor of­fers im­pro­ve­ments in firm­wa­re and SDK/GigE Vi­sion free of char­ge for the user. Be­ne­fit from con­ti­nuous pro­duct de­ve­lop­ment with ex­ce­llent ex­ten­ded fun­ctions. The Sha­pe­Dri­ve G4 sen­sors can be up­da­ted to the la­test ver­sions by the user.

Fle­xi­bi­lity Thanks to a Wide Range of Mo­dels

There are va­rious Sha­pe­Dri­ve G4 sen­sors which cover mea­su­ring ran­ges from a few cen­ti­me­ters to over one meter. For ex­tre­me re­qui­re­ments, there are also sen­sors with a ca­me­ra re­so­lu­tion of 12 MP that ac­cu­ra­tely cap­tu­re even the sma­llest de­tails.

Sha­pe­Dri­ve G4 MLAS 3D Sen­sors – Pre­ci­sion for Small Mea­su­ring Vo­lu­mes

The model va­riants of the Sha­pe­Dri­ve G4 MLAS se­ries are avai­la­ble in 5 and 12 me­ga­pi­xel va­riants. This allows even the sma­llest struc­tu­res to be dis­sol­ved. High-​quality op­tics en­su­re op­ti­mal illu­mi­na­tion and re­cor­ding, which form the basis for a per­fect mea­su­re­ment. Ac­ti­ve tem­pe­ra­tu­re ma­na­ge­ment mo­ni­tors and con­trols the in­ter­nal tem­pe­ra­tu­re of the 3D sen­sor so that a 3D point cloud with the best pos­si­ble qua­lity can be ge­ne­ra­ted.

The 3D Point Cloud of the MLAS 3D Sen­sors

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Les avan­ta­ges de la série MLAS en un coup d’œil

Nuage de pointsTechnologieConception

  1. Nuage de points

    • MPSoC haute per­for­man­ce avec FPGA pour cal­cul de nua­ges de points 3D in­té­gré avec des fré­quen­ces de me­su­re ma­xi­ma­les, jusqu’à 4 Hz (250 ms) selon l’ap­pli­ca­tion
    • Op­ti­que de haute qua­li­té pour un nuage de points 3D par­fait
    • Ges­tion ac­ti­ve de la tem­pé­ra­tu­re pour une qua­li­té op­ti­ma­le du nuage de points 3D

  2. Tech­no­lo­gie

    • Ether­net ra­pi­de jusqu’à 10 Gbit/s
    • Com­mu­ni­ca­tion di­rec­te via qua­tre E/S nu­mé­ri­ques
    • In­té­gra­tion fa­ci­le via SDK/GigE Vi­sion
    • Dif­fé­ren­tes ré­so­lu­tions de ca­mé­ra : 5 MP ou 12 MP
    • Vo­lu­me de me­su­re de 60 × 40 × 40 mm à 240 x 200 × 200 mm
    • Con­nec­teurs M12 stan­dard pour des con­ne­xions fia­bles

  3. Con­cep­tion

    • Boîtier ro­bus­te en alu­mi­ni­um avec in­di­ce de pro­tec­tion IP67
    • Con­cep­tion com­pac­te et légère pour les ap­pli­ca­tions ro­bo­ti­sées (poids < 2 kg)

MLAS 3D 传感器的测量体积

MLAS 系列的测量范围为 60 × 40 × 40 mm 至 240 × 200 × 200 mm，分为三个测量范围。通过测量体积的分级，可以为相应的应用选择适当的 3D 机器视觉传感器，以实现 3D 点云的最佳分辨率。
为了方便集成，除了快速传输数据用的 1/10 千兆以太网接口之外，该传感器还提供数字 I/O，因此传感器可以直接与环境通信。
该传感器设有标准 M12 接口，因此可与行业标准连接技术一起使用。外壳的防护等级为 IP67，可在恶劣或通常多尘的生产环境可靠运行。 

The MLAS 3D Sen­sor Mo­dels

Ca­me­ra re­so­lu­tion 5 MP
MLAS112 MLAS113 MLAS114
Wor­king range Z 300…340 mm 220…320 mm 400…600 mm
Mea­su­ring range Z 40 mm 100 mm 200 mm
Mea­su­ring range X 60 mm 120 mm 240 mm
Mea­su­ring range Y 48 mm 90 mm 200 mm
Re­so­lu­tion Z 3…4 µm 4…8 µm 13…30 µm
Re­so­lu­tion X/Y 30…34 µm 47…69 µm 115…172 µm
Hou­sing di­men­sions 60 × 250.8 × 160 mm 60 × 250.8 × 160 mm 60 × 250.8 × 160 mm
Ca­me­ra re­so­lu­tion 5 MP
摄像头分辨率 12 MP
MLAS212 MLAS213 MLAS214
Z 轴工作范围 255…295 mm 220…320 mm 270…470 mm
Z 轴测量范围 40 mm 100 mm 200 mm
X 轴测量范围 60 mm 120 mm 240 mm
Y 轴测量范围 40 mm 80 mm 160 mm
Z 轴分辨率 1…2 µm 2…5 µm 3…9 µm
X/Y 轴分辨率 18…20 µm 30…44 µm 37…65 µm
外壳尺寸 60 × 250.8 × 160 mm 60 × 250.8 × 160 mm 60 × 250.8 × 160 mm

 

 
摄像头分辨率 12 MP

 

 

Sha­pe­Dri­ve G4 型 MLBS 3D 传感器测量体积大

Sha­pe­Dri­ve G4 型 MLBS 系列的三种型号非常适合于板条箱、托盘等大的测量体积。三种型号的测量体积范围为 500 × 380 × 400 mm 至 1,300 × 1,000 × 1,000 mm，与 MLAS 系列的测量体积一致。传感器的强大照明系统可以缩短曝光时间，特别是对于深色物体或大的工作距离。

MLBS 系列传感器采用对称结构。这意味着测量体积不在传感器的摄像头正下方，而是位于传感器的中心位置。这可通过照明系统和摄像头的对称倾斜来识别。对称性可降低阴影效果，例如板条箱。如此可以检测整个板条箱。

MLBS 3D 传感器的 3D 点云

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MLBS 系列优点概况

点云技术设计

  1. 点云

    • 高性能 FPGA 用于 3D 点云的综合计算，可实现最高的测量速率，具体取决于应用，最高可达 4 Hz（250 ms）
    • 高品质光学系统创造完美的 3D 点云
    • 主动热管理，确保 3D 点云的最佳品质

  2. 技术

    • 以太网速度快，最高可达 10 Gbps
    • 通过四个数字 I/O 直接通信
    • 通过 SDK/GigE Vi­sion 轻松集成
    • 高性能照明系统，可缩短曝光时间
    • 测量体积为 500 × 380 × 400 mm 至 1,300 × 1,000 × 100 mm
    • 标准 M12 接口实现可靠连接

  3. 设计

    • 铝质外壳坚固，防护等级为 IP67
    • 对称设计，可减少阴影

The Mea­su­ring Vo­lu­me of the MLBS 3D Sen­sors

The three va­riants of the MLBS se­ries form a mea­su­ring vo­lu­me from 500 × 380 × 400 mm to 1,300 × 1,000 × 1,000 mm and thus fo­llow those of the MLAS se­ries. The di­gi­tal I/Os and the up to 10 Gi­ga­bit Ether­net in­ter­fa­ce enable ef­fec­ti­ve and fast in­te­gra­tion into the on-​site in­fras­truc­tu­re.
The alu­mi­num hou­sing pro­vi­des re­lia­ble pro­tec­tion in a ma­nu­fac­tu­ring en­vi­ron­ment. Thanks to their IP67 pro­tec­tion, the sen­sors are sui­ta­ble for use in harsh in­dus­trial en­vi­ron­ments. The sen­sor has stan­dard M12 con­nec­tions and can the­re­fo­re be used with stan­dard in­dus­trial con­nec­tion tech­no­logy.
Ca­me­ra re­so­lu­tion 5 MP
MLBS111 MLBS112 MLBS115
Wor­king range Z 1,050…1,450 mm 1,550…2,050 mm 1,750…2,750 mm
Mea­su­ring range Z 400 mm 500 mm 1,000 mm
Mea­su­ring range X 500 mm 750 mm 1,300 mm
Mea­su­ring range Y 380 mm 560 mm 1,000 mm
Re­so­lu­tion Z 40 µm 50 µm 80 µm
Re­so­lu­tion X/Y 281 µm 406 µm 660 µm
Hou­sing di­men­sions 60 × 214 × 375 mm 60 × 214 × 554 mm 60 × 214 × 611 mm


 
Ca­me­ra re­so­lu­tion 5 MP


 
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